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PRELIMINARY CM1425 4 Channel EMI Filter Array with ESD Protection
Features
* * * * * * * * Four channels of EMI filtering with ESD protection Pin compatible with CMD's CSPRC032A Greater than 30dB attenuation over the 800MHz to 3GHz frequency range 15kV ESD protection (IEC 61000-4-2, contact discharge) 30kV ESD protection (HBM) 9-bump, 2.470mm x 0.970mm footprint Chip Scale Package (CSP) Available with OptiguardTM coating for improved reliability Lead-free versions available
Product Description
CAMD's CM1425 is an EMI filter array with ESD protection, which integrates 4 pi filters (C-R-C). The CM1425 has component values of 20pF-100-20pF. The parts include ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of 15kV, beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than 30kV. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-touse pin assignments. In particular, the CM1425 is ideal for EMI filtering and protecting data lines from ESD in wireless handsets. All CM1425 devices are optionally available with OptiGuardTM coating which results in improved reliability at assembly. These devices are also available with standard and lead-free finishing. The CM1425 is housed in a space-saving, low-profile, chip-scale package and is fabricated with California Micro Devices' CenturionTM processes.
Applications
* * * * FIltering for antenna and keypad data lines I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. EMI filtering for LCD and chip-to-chip data lines in mobile electronic devices that use flexible PCB interconnections
Electrical Schematic
100 FILTER+ESD1* 20pF 20pF FILTER+ESD1* FILTER+ESD3* 20pF 20pF 100 FILTER+ESD3*
GND (Pin B3)
100 FILTER+ESD2* 20pF 20pF FILTER+ESD2* FILTER+ESD4*
100 FILTER+ESD4* 20pF 20pF
(c) 2004 California Micro Devices Corp. All rights reserved. 04/21/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
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PRELIMINARY CM1425
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
(Bumps Down View)
BOTTOM VIEW
(Bumps Up View)
Orientation Marking (see note 2)
1 A B
2
3
4
5
A5 B5 A4 B4 B3 A2 B2 A1 B1
N251
1 2 3 4 5
CM1425-01 CSP Package (No coating)
Orientation Marking (see note 2)
A B
N253
A5 B5
A4 B4 B3
A2 B2
A1 B1
Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
CM1425-03 CSP Package (OptiGuardTM coating)
PIN DESCRIPTIONS
PIN(s) A1 A2 A4 A5 B3 NAME FILTER+ESD1 FILTER+ESD2 FILTER+ESD3 FILTER+ESD4 GND DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Device Ground PIN(s) B1 B2 B4 B5 NAME FILTER+ESD1 FILTER+ESD2 FILTER+ESD3 FILTER+ESD4 DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4
Ordering Information
PART NUMBERING INFORMATION
Standard Finish No Coating Ordering Part Bumps 9 PKG CSP Number1 CM1425-01CS Part Marking N251 OptiguardTM Coated Ordering Part Number1 CM1425-03CS Part Marking N253 Lead-free Finish2 No Coating Ordering Part Number1 CM1425-01CP Part Marking N251 OptiguardTM Coated Ordering Part Number1 CM1425-03CP Part Marking N253
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
04/21/04
PRELIMINARY CM1425
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range Power Rating per Resistor Package Power Rating RATING -65 to +150 100 300 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL R C VDIODE ILEAK VSIG PARAMETER Resistance Capacitance Diode Standoff Voltage Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-42 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off Frequency ZSOURCE=50, ZLOAD=50 At 2.5V DC, 1MHz, 30mV AC IDIODE = 10A VDIODE = 3.3V ILOAD = 10mA ILOAD = -10mA Notes 2,4 and 5 30 15 Notes 2,3,4 and 5 +12 -7 R = 100, C = 20pF 86 MHz V V kV kV 5.6 -1.5 6.8 -0.8 CONDITIONS MIN 80 16 5.5 100 9.0 -0.4 TYP 100 20 MAX 120 24 UNITS pF V nA V V
VESD
VCL
fC
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization.
(c) 2004 California Micro Devices Corp. All rights reserved. 04/21/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
3
PRELIMINARY CM1425
Performance Information
.
Figure 1. CM1425 Filter Typical Measured Frequency Response
Figure 2. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25C)
(c) 2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
04/21/04
PRELIMINARY CM1425
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260C
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Stencil Opening 0.330mm DIA.
Solder Mask Opening 0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2004 California Micro Devices Corp. All rights reserved. 04/21/04
Figure 5. Lead-free (SnAgCu) Solder Ball Reflow Profile
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
5
PRELIMINARY CM1425
Mechanical Details
CM1425 devices are packaged in a custom Chip Scale Packages (CSP) and available with optional OptiGuardTM coating. . CM1425 9-bump CSP Mechanical Specifications The CM1425 devices are packaged in a 9-bump custom Chip Scale Package (CSP). Dimensions are presented below.
BOTTOM VIEW
A1 C1 B1 B2
Mechanical Package Diagrams Non-coated CSP
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 C1 C2 D11 D21 D32 D42 Millimeters Min 0.925 2.425 0.495 0.495 0.185 0.185 0.562 0.356 0.600 0.394 Nom 0.970 2.470 0.500 0.500 0.235 0.235 0.606 0.381 0.670 0.445 Max 1.015 2.515 0.505 0.505 0.285 0.285 0.650 0.406 0.739 0.495 Min Custom CSP 9 Inches Nom Max 0.0364 0.0382 0.0400 0.0955 0.0972 0.0990 0.0195 0.0197 0.0199 0.0195 0.0197 0.0199 0.0073 0.0093 0.0112 0.0073 0.0093 0.0112 0.0221 0.0239 0.0256 0.0140 0.0150 0.0160 0.0236 0.0264 0.0291 0.0155 0.0175 0.0195 3500 pieces Controlling dimension: millimeters
Note 1: Applies to uncoated devices only. Note 2: Applies to OptiGuard (coated) devices only.
B1
5 4 3 2 1 B A D1 B A C2 A2
0.30 DIA. D2 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
SIDE VIEW
OptiGuardTM Coated CSP
BOTTOM VIEW
A1 C1 B2
OptiGuardTM Coating
# per tape and reel
5 4 3 2 1 B A D3 B A C2 A2
0.30 DIA. D4 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
SIDE VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions CM1425 9-bump Chip Scale Package
(c) 2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
04/21/04
PRELIMINARY CM1425
Mechanical Details (cont'd)
CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 2.62 X 1.12 X 0.762 2.62 X 1.12 X 0.762
Po Top Cover Tape
PART NUMBER CM1425-01 CM1425-03
PKG. SIZE (mm) 2.470 X 0.970 X 0.606 2.470 X 0.970 X 0.670
TAPE WIDTH W 8mm 8mm
REEL DIA. 178mm (7") 178mm (7")
QTY PER REEL 3500 3500
P0 4mm 4mm
P1 4mm 4mm
10 Pitches Cumulative Tolerance On Tape 0.2 mm
Ao W
Ko
Bo
For tape feeder reference only including draft. Concentric around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 6. Tape and Reel Mechanical Data
(c) 2004 California Micro Devices Corp. All rights reserved. 04/21/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com
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